Andy Dai

According to our database, Andy Dai authored at least 2 papers in 2014.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2014

Reliability enhancement by integrated liquid cooling in power IGBT modules for hybrid and electric vehicles.

Yangang Wang, Steve Jones, Andy Dai, Guoyou Liu

Microelectron. Reliab., 2014

Study of failure mechanism in the modern IGBT with a highly doped N-buffer layer.

Chunlin Zhu, Ian Deviny, Gary Liu, Andy Dai

Proceedings of the IECON 2014 - 40th Annual Conference of the IEEE Industrial Electronics Society, Dallas, TX, USA, October 29, 2014