Andrzej Radecki

According to our database, Andrzej Radecki authored at least 9 papers between 2011 and 2020.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2020

Interactive sonification of images in serious games as an education aid for visually impaired children.

Andrzej Radecki, Michal Bujacz, Piotr Skulimowski, Pawel Strumillo

Br. J. Educ. Technol., 2020

2019

Interactive sonification of U-depth images in a navigation aid for the visually impaired.

Piotr Skulimowski, Mateusz Owczarek, Andrzej Radecki, Michal Bujacz, Dariusz Rzeszotarski, Pawel Strumillo

J. Multimodal User Interfaces, 2019

2018

A Mobile Application for Interactive Sonification of Images for the Visually Impaired.

Pawel Strumillo, Piotr Skulimowski, Michal Bujacz, Mark Obuchowicz, Izabela Borowiecka, Mateusz Holak, Andrzej Radecki

Proceedings of the 11th International Conference on Human System Interaction, 2018

2017

Interactive sonification of images on mobile devices for the visually impaired.

Andrzej Radecki, Michal Bujacz, Piotr Skulimowski, Pawel Strumillo

Proceedings of the Signal Processing: Algorithms, 2017

2012

Simultaneous 6-Gb/s Data and 10-mW Power Transmission Using Nested Clover Coils for Noncontact Memory Card.

Andrzej Radecki, Yuxiang Yuan, Noriyuki Miura, Iori Aikawa, Yasuhiro Take, Hiroki Ishikuro, Tadahiro Kuroda

IEEE J. Solid State Circuits, 2012

Rotary Coding for Power Reduction and S/N Improvement in Inductive-Coupling Data Communication.

Andrzej Radecki, Noriyuki Miura, Hiroki Ishikuro, Tadahiro Kuroda

IEEE J. Solid State Circuits, 2012

A 0.025-0.45 W 60%-Efficiency Inductive-Coupling Power Transceiver With 5-Bit Dual-Frequency Feedforward Control for Non-Contact Memory Cards.

Hayun Chung, Andrzej Radecki, Noriyuki Miura, Hiroki Ishikuro, Tadahiro Kuroda

IEEE J. Solid State Circuits, 2012

6 W/25 mm² Wireless Power Transmission for Non-contact Wafer-Level Testing.

Andrzej Radecki, Hayun Chung, Yoichi Yoshida, Noriyuki Miura, Tsunaaki Shidei, Hiroki Ishikuro, Tadahiro Kuroda

IEICE Trans. Electron., 2012

2011

6W/25mm² inductive power transfer for non-contact wafer-level testing.

Andrzej Radecki, Hayun Chung, Yoichi Yoshida, Noriyuki Miura, Tsunaaki Shidei, Hiroki Ishikuro, Tadahiro Kuroda

Proceedings of the IEEE International Solid-State Circuits Conference, 2011