Andreas Schletz

According to our database, Andreas Schletz authored at least 6 papers between 2013 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2018

Influence of the pulse length and temperature swing on the relative lifetime estimation for sintered/soldered chip-on-substrate samples via FE-simulation of power cycles.

F. B. Simon, S. A. Letz, Andreas Schletz

Microelectron. Reliab., 2018

Modeling the rate-dependent inelastic deformation behavior of porous polycrystalline silver films.

S. A. Letz, A. Farooghian, F. B. Simon, Andreas Schletz

Microelectron. Reliab., 2018

2016

Lifetime and manufacturability of integrated power electronics.

Richard Randoll, Wolfgang Wondrak, Andreas Schletz

Microelectron. Reliab., 2016

2015

Characteristics and aging of PCB embedded power electronics.

Richard Randoll, Mahmud Asef, Wolfgang Wondrak, Lars Böttcher, Andreas Schletz

Microelectron. Reliab., 2015

2014

Dielectric strength and thermal performance of PCB-embedded power electronics.

Richard Randoll, Wolfgang Wondrak, Andreas Schletz

Microelectron. Reliab., 2014

2013

Extending the lifetime of power electronic assemblies by increased cooling temperatures.

Aaron Hutzler, Adam Tokarski, Andreas Schletz

Microelectron. Reliab., 2013