André Zimmermann

According to our database, André Zimmermann authored at least 20 papers between 2017 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Product Development Processes for Individualized Products: A Case Study.

Faruk Civelek, Alexander Brem, Karl-Peter Fritz, André Zimmermann

IEEE Trans. Engineering Management, 2024

Meta-learning for few-shot sensor self-calibration to increase stress robustness.

Patrick Tritschler, Torsten Ohms, Bin Yang, André Zimmermann

Eng. Appl. Artif. Intell., 2024

2023

Review on Excess Noise Measurements of Resistors.

Daniela Walter, André Bülau, André Zimmermann

Sensors, February, 2023

2022

Inkjet-Printed Temperature Sensors Characterized according to Standards.

Jonas Jäger, Adrian Schwenck, Daniela Walter, André Bülau, Kerstin Gläser, André Zimmermann

Sensors, 2022

Towards Reliable Parameter Extraction in MEMS Final Module Testing Using Bayesian Inference.

Monika Elisabeth Heringhaus, Yi Zhang, André Zimmermann, Lars Mikelsons

Sensors, 2022

Graph neural networks for parameter estimation in micro-electro-mechanical system testing.

Monika Elisabeth Heringhaus, Alexander Buhmann, Jürgen Müller, André Zimmermann

Array, 2022

2021

Characterization and Benchmark of a Novel Capacitive and Fluidic Inclination Sensor.

Adrian Schwenck, Thomas Günther, André Zimmermann

Sensors, 2021

Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane.

Adrian Schwenck, Tobias Grözinger, Thomas Günther, Axel Schumacher, Dietmar Schuhmacher, Kai Werum, André Zimmermann

Sensors, 2021

Development and Proof of Concept of a Miniaturized MEMS Quantum Tunneling Accelerometer Based on PtC Tips by Focused Ion Beam 3D Nano-Patterning.

Michael Haub, Martin Bogner, Thomas Günther, André Zimmermann, Hermann Sandmaier

Sensors, 2021

2020

Quadrature Block for UHF Reflection Coefficient Measurements Using a Directional Coupler and Injection Locking.

Volker Kible, Robson Nunes de Lima, Karolinne B. Brito, André Bülau, André Zimmermann

IEEE Trans. Instrum. Meas., 2020

Identification of the Viscoelastic Properties of Soft Thermal Interface Layers Through Forward and Inverse Measurement Techniques.

Alaa Fezai, Anuj Sharma, Wolfgang Müller-Hirsch, André Zimmermann

IEEE Trans. Instrum. Meas., 2020

Inkjet-Printing of Nanoparticle Gold and Silver Ink on Cyclic Olefin Copolymer for DNA-Sensing Applications.

Martin Trotter, Daniel Juric, Zahra Bagherian, Nadine Borst, Kerstin Gläser, Thomas Meissner, Felix von Stetten, André Zimmermann

Sensors, 2020

Robust and fast part traceability in a production chain exploiting inherent, individual surface patterns.

Benedikt Wigger, Ingo Koinzer, Thomas Meissner, Maximilian Barth, André Zimmermann

Robotics Comput. Integr. Manuf., 2020

2019

Application of human motion energy harvesters on industrial linear technology.

Lukas Lamprecht, Ricardo Ehrenpfordt, Tobias Zoller, André Zimmermann

IET Wirel. Sens. Syst., 2019

A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation.

Mahdi Soltani, Romit Kulkarni, Tobias Scheinost, Tobias Groezinger, André Zimmermann

IEEE Access, 2019

2018

Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation.

Paul Wild, Dominik Lorenz, Tobias Grözinger, André Zimmermann

Microelectron. Reliab., 2018

Effect of Joule heating on the reliability of solder joints under power cycling conditions.

Jie Mei, R. Haug, O. Lanier, Tobias Grözinger, André Zimmermann

Microelectron. Reliab., 2018

Reliability Study and Thermal Performance of LEDs on Molded Interconnect Devices (MID) and PCB.

Mahdi Soltani, Moritz Freyburger, Romit Kulkarni, Rainer Mohr, Tobias Groezinger, André Zimmermann

IEEE Access, 2018

2017

Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates.

Paul Wild, Tobias Grözinger, Dominik Lorenz, André Zimmermann

IEEE Trans. Reliab., 2017

Flexible Packaging by Film-Assisted Molding for Microintegration of Inertia Sensors.

Daniel Hera, Armin Berndt, Thomas Günther, Stephan Schmiel, Christine Harendt, André Zimmermann

Sensors, 2017