Allison T. Osmanson

According to our database, Allison T. Osmanson authored at least 2 papers between 2020 and 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2021

Mechanisms of Contact Formation and Electromigration Reliability in Wirebond Packages.

Allison T. Osmanson, Mohsen Tajedini, Yi Ram Kim, Hossein Madanipour, Choong-Un Kim, Bradley Glasscock, Muhammad Khan

Proceedings of the IEEE International Reliability Physics Symposium, 2021

2020

Effects of UBM Thickness and Current Flow Configuration on Electromigration Failure Mechanisms in Solder Interconnects.

Yi Ram Kim, Allison T. Osmanson, Hossein Madanipour, Choong-Un Kim, Patrick F. Thompson, Qiao Chen

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020