Alexis Farcy

According to our database, Alexis Farcy authored at least 23 papers between 2008 and 2021.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2021

IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management.

Pascal Vivet, Eric Guthmuller, Yvain Thonnart, Gaël Pillonnet, César Fuguet Tortolero, Ivan Miro-Panades, Guillaume Moritz, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy

IEEE J. Solid State Circuits, 2021

2020

2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm² Inter-Chiplet Interconnects and 156mW/mm²@ 82%-Peak-Efficiency DC-DC Converters.

Pascal Vivet, Eric Guthmuller, Yvain Thonnart, Gaël Pillonnet, Guillaume Moritz, Ivan Miro-Panades, César Fuguet Tortolero, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy

Proceedings of the 2020 IEEE International Solid- State Circuits Conference, 2020

2018

Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability.

Lucile Arnaud, Stéphane Moreau, Amadine Jouve, Imed Jani, Didier Lattard, F. Fournel, C. Euvrard, Y. Exbrayat, Viorel Balan, Nicolas Bresson, S. Lhostis, J. Jourdon, E. Deloffre, S. Guillaumet, Alexis Farcy, Simon Gousseau, M. Arnoux

Proceedings of the IEEE International Reliability Physics Symposium, 2018

2016

Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits.

Perceval Coudrain, Papa Momar Souare, Rafael Prieto, Vincent Fiori, Alexis Farcy, Laurent Le Pailleur, Jean-Philippe Colonna, Cristiano Santos, Pascal Vivet, M. Haykel Ben Jamaa, Denis Dutoit, François de Crecy, Sylvain Dumas, Christian Chancel, Didier Lattard, Séverine Cheramy

IEEE Des. Test, 2016

Heat spreading packaging solutions for hybrid bonded 3D-ICs.

Rafael Prieto, Perceval Coudrain, Jean-Philippe Colonna, Y. Hallez, Christian Chancel, Venceslass Rat, Sylvain Dumas, G. Romano, R. Franiatte, C. Brunet-Manquiat, Séverine Cheramy, Alexis Farcy

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

ITAC: A complete 3D integration test platform.

Didier Lattard, Lucile Arnaud, Arnaud Garnier, Nicolas Bresson, Franck Bana, R. Segaud, Amadine Jouve, H. Jacquinot, Stéphane Moreau, Karim Azizi-Mourier, C. Chantre, Pascal Vivet, Gaël Pillonnet, F. Casset, F. Ponthenier, Alexis Farcy, S. Lhostis, Jean Michailos, Alexandre Arriordaz, Séverine Cheramy

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence.

Simon Gousseau, Stéphane Moreau, David Bouchu, Alexis Farcy, Pierre Montmitonnet, Karim Inal, François Bay, Marc Zelsmann, Emmanuel Picard, Mathieu Salaün

Microelectron. Reliab., 2015

Recent progress in Silicon Photonics R&D and manufacturing on 300mm wafer platform.

Frédéric Boeuf, Sebastien Cremer, Enrico Temporiti, Massimo Fere, Mark Shaw, Nathalie Vulliet, Bastien Orlando, Delia Ristoiu, Alexis Farcy, Thierry Pinguet, Attila Mekis, Gianlorenzo Masini, Peng Sun, Yuemeng Chi, Herve Petiton, Sebastien Jan, Jean-Robert Manouvrier, Charles Baudot, Patrick Le Maitre, Jean Francois Carpentier, Laurent Salager, Matteo Traldi, Luca Maggi, Danilo Rigamonti, Chiara Zaccherini, Carolina Elemi, Bernard Sautreuil, Luigi Verga

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2015

Stress management strategy to limit die curvature during silicon interposer integration.

Benjamin Vianne, Alexis Farcy, Vincent Fiori, Cédrick Chappaz, Norbert Chevrier, G. Lobascio, Pascal Chausse, F. Ponthenier, A. Ruckly, Stéphanie Escoubas, Olivier Thomas

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

EUROSERVER: Energy Efficient Node for European Micro-Servers.

Yves Durand, Paul M. Carpenter, Stefano Adami, Angelos Bilas, Denis Dutoit, Alexis Farcy, Georgi Gaydadjiev, John Goodacre, Manolis Katevenis, Manolis Marazakis, Emil Matús, Iakovos Mavroidis, John Thomson

Proceedings of the 17th Euromicro Conference on Digital System Design, 2014

Using TSVs for thermal mitigation in 3D circuits: Wish and truth.

Cristiano Santos, Papa Momar Souare, François de Crecy, Perceval Coudrain, Jean-Philippe Colonna, Pascal Vivet, Andras Borbely, Ricardo Reis, M. Haykel Ben Jamaa, Vincent Fiori, Alexis Farcy

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

Electrical model and characterization of Through Silicon Capacitors (TSC) in silicon interposer.

Khadim Dieng, Philippe Artillan, Cédric Bermond, Olivier Guiller, Thierry Lacrevaz, Sylvain Joblot, Gregory Houzet, Alexis Farcy, Yann Lamy, Bernard Fléchet

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developments.

Benjamin Vianne, Pierre Bar, Vincent Fiori, Sebastien Petitdidier, Norbert Chevrier, Sébastien Gallois-Garreignot, Alexis Farcy, Pascal Chausse, Stéphanie Escoubas, Nicolas Hotellier, Olivier Thomas

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Thermal correlation between measurements and FEM simulations in 3D ICs.

Papa Momar Souare, François de Crecy, Vincent Fiori, M. Haykel Ben Jamaa, Alexis Farcy, Sébastien Gallois-Garreignot, Andras Borbely, Jean-Philippe Colonna, Perceval Coudrain, B. Giraud, C. Laviron, Séverine Cheramy, Clément Tavernier, Jean Michailos

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration.

Sylvain Joblot, Alexis Farcy, Nicolas Hotellier, Amadine Jouve, François de Crecy, Arnaud Garnier, M. Argoud, C. Ferrandon, J.-P. Colonna, R. Franiatte, C. Laviron, Séverine Cheramy

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

RF characterization of substrate coupling between TSV and MOS transistors in 3D integrated circuits.

Melanie Brocard, Cédric Bermond, Thierry Lacrevaz, Alexis Farcy, Patrick Le Maitre, P. Scheer, Patrick Leduc, Séverine Cheramy, Bernard Fléchet

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2012

Device and electromagnetic co-simulation of TSV: Substrate noise study and compact modeling of a TSV in a matrix.

Patrick Le Maitre, Melanie Brocard, Alexis Farcy, Jean-Claude Marin

Proceedings of the Thirteenth International Symposium on Quality Electronic Design, 2012

2011

3D integration demonstration of a wireless product with design partitioning.

G. Druais, Pascal Ancey, C. Aumont, V. Caubet, Laurent-Luc Chapelon, C. Chaton, Séverine Cheramy, S. Cordova, E. Cirot, Jean-Philippe Colonna, Perceval Coudrain, T. Divel, Y. Dodo, Alexis Farcy, N. Guitard, K. Haxaire, Nicolas Hotellier, F. Leverd, R. Liou, Jean Michailos, A. Ostrovsky, Sebastien Petitdidier, J. Pruvost, D. Riquet, O. Robin, E. Saugier, Nicolas Sillon

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2009

Influence of 3D integration on 2D interconnections and 2D self inductors HF properties.

Julie Roullard, Stéphane Capraro, Thierry Lacrevaz, Lionel Cadix, Elie Eid, Alexis Farcy, Bernard Fléchet

Proceedings of the IEEE International Conference on 3D System Integration, 2009

First integration of Cu TSV using die-to-wafer direct bonding and planarization.

Patrick Leduc, Myriam Assous, Léa Di Cioccio, Marc Zussy, Thomas Signamarcheix, Antonio Roman, Maxime Rousseau, Sophie Verrun, Laurent Bally, David Bouchu, Lionel Cadix, Alexis Farcy, Nicolas Sillon

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Predictive High Frequency effects of substrate coupling in 3D integrated circuits stacking.

Elie Eid, Thierry Lacrevaz, Sébastien de Rivaz, Cédric Bermond, Bernard Fléchet, Françis Calmon, Christian Gontrand, Alexis Farcy, Lionel Cadix, Pascal Ancey

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Modelling of Through Silicon Via RF performance and impact on signal transmission in 3D integrated circuits.

Lionel Cadix, Alexis Farcy, Cédric Bermond, Christine Fuchs, Patrick Leduc, Maxime Rousseau, Myriam Assous, Alexandre Valentian, Julie Roullard, Elie Eid, Nicolas Sillon, Bernard Fléchet, Pascal Ancey

Proceedings of the IEEE International Conference on 3D System Integration, 2009

2008

Predictive Delay Evaluation on Emerging CMOS Technologies: A Simulation Framework.

Manuel Sellier, Jean-Michel Portal, Bertrand Borot, Steve Colquhoun, Richard Ferrant, Frédéric Boeuf, Alexis Farcy

Proceedings of the 9th International Symposium on Quality of Electronic Design (ISQED 2008), 2008