Alex Juan

According to our database, Alex Juan authored at least 1 paper in 2020.

Collaborative distances:

• Dijkstra number of seven.
• Erdős number of six.

2020

Stress Induced Voiding Behavior of Electroplated Copper Thin Films in Highly Scaled Cu/low-k interconnects.

Clement Huang, Alex Juan, K. C. Su

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020