Alan Huffman

According to our database, Alan Huffman authored at least 2 papers between 2010 and 2013.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2013

High density interconnect bonding of heterogeneous materials using non-collapsible microbumps at 10 μm pitch.

Matthew Lueck, Chris W. Gregory, Dean Malta, Alan Huffman, John M. Lannon, Dorota Temple

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2010

Fabrication of TSV-based silicon interposers.

Dean Malta, Erik Vick, Scott H. Goodwin, Christopher Gregory, Matthew Lueck, Alan Huffman, Dorota Temple

Proceedings of the IEEE International Conference on 3D System Integration, 2010