Akitsu Shigetou

According to our database, Akitsu Shigetou authored at least 4 papers between 2011 and 2019.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of four.

2019

Hydrolysis-Tolerant Hybrid Bonding in Ambient Atmosphere for 3D Integration.

Akitsu Shigetou, Tilo H. Yang, C. Robert Kao

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2016

Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection.

Masaki Ohyama, Masatsugu Nimura, Jun Mizuno, Shuichi Shoji, Toshihisa Nonaka, Yoichi Shinba, Akitsu Shigetou

Microelectron. Reliab., 2016

2012

Nanoadhesion layer for enhanced Si-Si and Si-SiN wafer bonding.

Ryuichi Kondou, Chenxi Wang, Akitsu Shigetou, Tadatomo Suga

Microelectron. Reliab., 2012

2011

Low temperature Au-Au bonding with VUV/O3 treatment.

Akiko Okada, Masatsugu Nimura, Naoko Unami, Akitsu Shigetou, Hirokazu Noma, Katsuyuki Sakuma, Jun Mizuno, Shuichi Shoji

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011