Akira Uedono
Orcid: 0000-0001-6224-4869
According to our database1,
Akira Uedono
authored at least 3 papers
between 2013 and 2024.
Collaborative distances:
Collaborative distances:
Timeline
2014
2016
2018
2020
2022
2024
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Bibliography
2024
Impact of Cu Pad Density on Cu-CMP and Bonding Yield for Chip-to-Wafer Hybrid Bonding.
Proceedings of the International 3D Systems Integration Conference, 2024
2022
Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022
2013
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013