Akira Uedono

Orcid: 0000-0001-6224-4869

According to our database1, Akira Uedono authored at least 3 papers between 2013 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

2014
2016
2018
2020
2022
2024
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1
2
1
1
1

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

On csauthors.net:

Bibliography

2024
Impact of Cu Pad Density on Cu-CMP and Bonding Yield for Chip-to-Wafer Hybrid Bonding.
Proceedings of the International 3D Systems Integration Conference, 2024

2022
Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

2013
Influence of wafer thinning process on backside damage in 3D integration.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013


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