Akihito Kawai

According to our database, Akihito Kawai authored at least 2 papers between 2011 and 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2013

Influence of wafer thinning process on backside damage in 3D integration.

Tadao Nakamura, Yoriko Mizushima, Hideki Kitada, Young-Suk Kim, Nobuhide Maeda, Shoichi Kodama, Ryuichi Sugie, Hiroshi Hashimoto, Akihito Kawai, Kazuhisa Arai, Akira Uedono, Takayuki Ohba

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011

Development of ultra-thinning technology for logic and memory heterogeneous stack applications.

Nobuhide Maeda, Young-Suk Kim, Y. Hikosaka, T. Eshita, Hideki Kitada, K. Fujimoto, Yoriko Mizushima, K. Suzuki, Tadao Nakamura, Akihito Kawai, Kazuhisa Arai, Takayuki Ohba

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011