Akihiro Noriki

According to our database, Akihiro Noriki authored at least 8 papers between 2009 and 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2021

Polymer Waveguide-coupled Co-packaged Silicon Photonics-die Embedded Package Substrate.

Takeru Amano, Akihiro Noriki, Isao Tamai, Yasuhiro Ibusuki, Akio Ukita, Satoshi Suda, Takayuki Kurosu, Koichi Takemura, Tsuyoshi Aoki, Daisuke Shimura, Yosuke Onawa, Hiroki Yaegashi

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2021

2020

Demonstration of Optical Re-Distribution on Silicon Photonics Die Using Polymer Waveguide and Micro Mirrors.

Akihiro Noriki, Isao Tamai, Yasuhiro Ibusuki, Akio Ukita, Satoshi Suda, Koichi Takemura, Daisuke Shimura, Yosuke Onawa, Hiroki Yaegashi, Takeru Amano

Proceedings of the European Conference on Optical Communications, 2020

2019

Vertical Optical and Electrical Interconnection for Chip-Scale-Packaged Si Photonic Transceivers.

Koichi Takemura, Akio Ukita, Yasuhiro Ibusuki, Mitsuru Kurihara, Akihiro Noriki, Takeru Amano, Daisuke Okamoto, Yasuyuki Suzuki, Kazuhiko Kurata

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

Optical TSV Using Si-Photonics Integrated Curved Micro-Mirror.

Akihiro Noriki, Isao Tamai, Yasuhiro Ibusuki, Akio Ukita, Satoshi Suda, Daisuke Shimura, Yosuke Onawa, Hiroki Yaegashi, Takeru Amano

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2011

Fabrication tolerance evaluation of high efficient unidirectional optical coupler for though silicon photonic via in optoelectronic 3D-LSI.

Akihiro Noriki, Kang Wook Lee, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

Through Silicon photonic via (TSPV) with Si core for low loss and high-speed data transmission in opto-electronic 3-D LSI.

Akihiro Noriki, Kang Wook Lee, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2009

10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack.

Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma, Kang Wook Lee, Mariappan Murugesan, Jichoel Bea, Fumiaki Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2009

Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration.

Ji Chel Bea, Mariappan Murugesan, Yuki Ohara, Akihiro Noriki, Hisashi Kino, Kang Wook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2009