Akihiro Ikeda

According to our database, Akihiro Ikeda authored at least 9 papers between 2011 and 2019.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2019

Formation of Low Resistance Contacts to p-type 4H-SiC using Al-Film Source Laser Doping.

Kento Okamoto, Toshifumi Kikuchi, Akihiro Ikeda, Hiroshi Ikenoue, Tanemasa Asano

Proceedings of the 7th International Conference on Photonics, Optics and Laser Technology, 2019

2018

Formal verification for wireless sensor network in consideration of communication errors.

Akihiro Ikeda, Naoki Akiyama, Toshiaki Miyazaki

Proceedings of the 2018 International Conference on Information Networking, 2018

2015

High-speed via hole filling using electrophoresis of Ag nanoparticles.

Ryo Takigawa, Kohei Nitta, Akihiro Ikeda, Mitsuaki Kumazawa, Toshiharu Hirai, Michio Komatsu, Tanemasa Asano

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2013

Development of a Portable Taste Sensor with a Lipid/Polymer Membrane.

Yusuke Tahara, Kenichi Nakashi, Ke Ji, Akihiro Ikeda, Kiyoshi Toko

Sensors, 2013

Data and Information Activities of ICSWSE, Kyushu University, Japan.

Shuji Abe, Kiyohumi Yumoto, Akihiro Ikeda, Teiji Uozumi, George Maeda

Data Sci. J., 2013

Surface passivation of Cu cone bump by self-assembled-monolayer for room temperature Cu-Cu bonding.

Akihiro Ikeda, L. J. Qiu, K. Nakahara, Tanemasa Asano

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011

Development and Evaluation of a Miniaturized Taste Sensor Chip.

Yusuke Tahara, Akihiro Ikeda, Yoshihiro Maehara, Masaaki Habara, Kiyoshi Toko

Sensors, 2011

Low-temperature bonding of LSI chips to PEN film using Au cone bump for heterogeneous integration.

Takanori Shuto, Naoya Watanabe, Akihiro Ikeda, Tanemasa Asano

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

High frequency signal transmission characteristics of cone bump interconnections.

Akihiro Ikeda, Naoya Watanabe, Tanemasa Asano

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011