Aizat Abas

Orcid: 0000-0002-7014-0370

According to our database1, Aizat Abas authored at least 8 papers between 2016 and 2021.

Collaborative distances:
  • Dijkstra number2 of six.
  • Erdős number3 of six.

Timeline

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Links

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Bibliography

2021
No-flow underfill: Effect of chip placement speed on the void formation using numerical method.
Microelectron. J., 2021

2018
Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches.
Microelectron. Reliab., 2018

2017
Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings.
Microelectron. Reliab., 2017

Discrete phase method particle simulation of ultra-fine package assembly with SAC305-TiO<sub>2</sub> nano-reinforced lead free solder at different weighted percentages.
Microelectron. Reliab., 2017

2016
Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array.
Microelectron. Reliab., 2016

Lattice Boltzmann method study of effect three dimensional stacking-chip package layout on micro-void formation during encapsulation process.
Microelectron. Reliab., 2016

Lattice Boltzmann method study of bga bump arrangements on void formation.
Microelectron. Reliab., 2016

Lattice Boltzmann Model of 3D Multiphase Flow in Artery Bifurcation Aneurysm Problem.
Comput. Math. Methods Medicine, 2016


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