Aizat Abas
Orcid: 0000-0002-7014-0370
According to our database1,
Aizat Abas
authored at least 8 papers
between 2016 and 2021.
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Bibliography
2021
No-flow underfill: Effect of chip placement speed on the void formation using numerical method.
Microelectron. J., 2021
2018
Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches.
Microelectron. Reliab., 2018
2017
Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings.
Microelectron. Reliab., 2017
Discrete phase method particle simulation of ultra-fine package assembly with SAC305-TiO<sub>2</sub> nano-reinforced lead free solder at different weighted percentages.
Microelectron. Reliab., 2017
2016
Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array.
Microelectron. Reliab., 2016
Lattice Boltzmann method study of effect three dimensional stacking-chip package layout on micro-void formation during encapsulation process.
Microelectron. Reliab., 2016
Microelectron. Reliab., 2016
Lattice Boltzmann Model of 3D Multiphase Flow in Artery Bifurcation Aneurysm Problem.
Comput. Math. Methods Medicine, 2016