Abhijit Dasgupta

Orcid: 0000-0002-3562-0803

Affiliations:
  • University of Maryland, Department of Mechanical Engineering, CALCE Electronic Packaging and Systems Center, College Park, MD, USA


According to our database1, Abhijit Dasgupta authored at least 7 papers between 2002 and 2017.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Bibliography

2017
Viscoplastic properties of pressure-less sintered silver materials using indentation.
Microelectron. Reliab., 2017

2016
Creep fatigue models of solder joints: A critical review.
Microelectron. Reliab., 2016

2014
Effect of geometric complexities and nonlinear material properties on interfacial crack behavior in electronic devices.
Microelectron. Reliab., 2014

Multi-physics simulations for combined temperature/humidity loading of potted electronic assemblies.
Microelectron. Reliab., 2014

2007
An experimental approach to characterize rate-dependent failure envelopes and failure site transitions in surface mount assemblies.
Microelectron. Reliab., 2007

Test methodology for durability estimation of surface mount interconnects under drop testing conditions.
Microelectron. Reliab., 2007

2002
Weapon and communication systems: virtual life assessment of electronic hardware used in the Advanced Amphibious Assault Vehicle (AAAV).
Proceedings of the 34th Winter Simulation Conference: Exploring New Frontiers, 2002


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