Abdul Hamid Bin Yousuf

According to our database, Abdul Hamid Bin Yousuf authored at least 5 papers between 2013 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2018

Investigation and Optimization of Spiral Inductor Design for On-Chip Buck Converter.

Emeshaw Ashenafi, Abdul Hamid Bin Yousuf, Masud H. Chowdhury

J. Low Power Electron., 2018

2017

Impacts of different shapes of through-silicon-via core on 3D IC performance.

Abdul Hamid Bin Yousuf, Nahid M. Hossain, Masud H. Chowdhury

Proceedings of the IEEE International Symposium on Circuits and Systems, 2017

2015

Analytical analysis of the contact resistance (Rc) of metal-MoS2 interface.

Munem Hossain, Muhammad Sanaullah, Abdul Hamid Bin Yousuf, Azzedin Es-Saki, Masud H. Chowdhury

Proceedings of the IEEE 58th International Midwest Symposium on Circuits and Systems, 2015

Performance analysis of through silicon via (TSV) and through glass via (TGV) for different materials.

Abdul Hamid Bin Yousuf, Nahid M. Hossain, Masud H. Chowdhury

Proceedings of the 2015 IEEE International Symposium on Circuits and Systems, 2015

2013

Thermal aware Graphene based Through Silicon Via design for 3D IC.

Nahid M. Hossain, MunEm Hossain, Abdul Hamid Bin Yousuf, Masud H. Chowdhury

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013