Abdellah Salahouelhadj

According to our database, Abdellah Salahouelhadj authored at least 2 papers in 2014.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2014

Reliability of thermally stressed rigid-flex printed circuit boards for High Density Interconnect applications.

Abdellah Salahouelhadj, Marion Martiny, Sebastien Mercier, Laurent Bodin, David Manteigas, B. Stephan

Microelectron. Reliab., 2014

Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges.

Joeri De Vos, Vladimir Cherman, Mikael Detalle, Teng Wang, Abdellah Salahouelhadj, Robert Daily, Geert Van der Plas, Eric Beyne

Proceedings of the 2014 International 3D Systems Integration Conference, 2014