Abdellah Benali
According to our database1,
Abdellah Benali
authored at least 2 papers
between 2013 and 2014.
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Bibliography
2014
A study of through package vias in a glass interposer for multifunctional and miniaturized systems.
Microelectron. Reliab., 2014
2013
Through glass via thermomechanical analysis: Geometrical parameters effect on thermal stress.
Proceedings of the 8th International Design and Test Symposium, 2013