Aashish Shah

According to our database, Aashish Shah authored at least 3 papers between 2011 and 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2013

Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding.

Alireza Rezvani, Aashish Shah, M. Mayer, Norman Y. Zhou, J. T. Moon

Microelectron. Reliab., 2013

2011

Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding.

Aashish Shah, Alireza Rezvani, M. Mayer, Norman Y. Zhou, John Persic, J. T. Moon

Microelectron. Reliab., 2011

Role of process parameters on bondability and pad damage indicators in copper ball bonding.

I. Qin, Aashish Shah, C. Huynh, M. Meyer, M. Mayer, Norman Y. Zhou

Microelectron. Reliab., 2011