Aamir Zia

According to our database, Aamir Zia authored at least 9 papers between 2005 and 2014.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2014

Design of BiCMOS SRAMs for high-speed SiGe applications.

Xuelian Liu, Mitchell R. LeRoy, Ryan Clarke, Michael Chu, H. O. Aquino, Srikumar Raman, Aamir Zia, Russell P. Kraft, John F. McDonald

IET Circuits Devices Syst., 2014

2012

A three-dimensional DRAM using floating body cell in FDSOI devices.

Xuelian Liu, Aamir Zia, Mitchell R. LeRoy, Srikumar Raman, Ryan Clarke, Russell P. Kraft, John F. McDonald

Proceedings of the IEEE 15th International Symposium on Design and Diagnostics of Electronic Circuits & Systems, 2012

2011

3D NOC for many-core processors.

Aamir Zia, Sachhidh Kannan, H. Jonathan Chao, Garrett S. Rose

Microelectron. J., 2011

Reconfigurable 40 GHz BiCMOS uniform delay crossbar switch for broadband and wide tuning range narrowband applications.

Jin Woo Kim, Michael Chu, Philip Jacob, Aamir Zia, Russell P. Kraft, John F. McDonald

IET Circuits Devices Syst., 2011

2010

A 3-D Cache With Ultra-Wide Data Bus for 3-D Processor-Memory Integration.

Aamir Zia, Philip Jacob, Jin Woo Kim, Michael Chu, Russell P. Kraft, John F. McDonald

IEEE Trans. Very Large Scale Integr. Syst., 2010

2009

Mitigating Memory Wall Effects in High-Clock-Rate and Multicore CMOS 3-D Processor Memory Stacks.

Philip Jacob, Aamir Zia, Okan Erdogan, Paul M. Belemjian, Jin Woo Kim, Michael Chu, Russell P. Kraft, John F. McDonald, Kerry Bernstein

Proc. IEEE, 2009

Thermal analysis for a SiGe HBT 40 watt 32 GHz clock 3D memory processor chip stack using diamond heat spreader layers.

John F. McDonald, Okan Erdogan, Philip Jacob, Paul M. Belemjian, Alexey Gutin, Aamir Zia, Michael Chu, Jin Woo Kim, Ryan Clarke, Nate DeSimone, Sherry Liu, Russell P. Kraft

Proceedings of the IEEE International Conference on 3D System Integration, 2009

2007

Amdahl's figure of merit, SiGe HBT BiCMOS, and 3D chip stacking.

Philip Jacob, Aamir Zia, Okan Erdogan, Paul M. Belemjian, Peng Jin, Jin Woo Kim, Michael Chu, Russell P. Kraft, John F. McDonald

Proceedings of the 25th International Conference on Computer Design, 2007

2005

Predicting the Performance of a 3D Processor-Memory Chip Stack.

Philip Jacob, Okan Erdogan, Aamir Zia, Paul M. Belemjian, Russell P. Kraft, John F. McDonald

IEEE Des. Test Comput., 2005