A. Baram

According to our database, A. Baram authored at least 1 paper in 2011.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2011

Ultra-compact micro-coil realized via multilevel dense TSV coil for MEMs application.

H. Y. Li, L. Xie, L. G. Ong, A. Baram, I. Herer, Arnon Hirshberg, S. C. Chong, D. L. Kwong

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011